Technical Capabilities
Finley Design Services has years of experience specializing in projects with mixed signal, high speed digital and RF applications. FDS specializes in the following Product Sectors and Package types.
Product Sectors
Digital
- High-speed
- USB 3.0
- SerDes
- PCI Express
- LVDS
Mixed Signal
- Power
- LAN
- A-D
- Graphics
Memory Applications
- DDR
- Rambus
Radio Frequency (RF)
- Up to 16 GHz
Package Types
- BGA
- QFP
- TQFP
- CSP
- QFN
- SOIC
- PLCC
- TSSOP
Experienced Pitch Sizes:
1.27mm, 1.00mm, .8mm, .5mm, .4mm, .3mm
CUSTOM SOLUTIONS
We offer full support for layout, fabrication, QC and assembly of your ATE project. Our success can be seen in test houses and on production test floors globally.
